BPA for Polyamide Compounds - Top China Suppliers & Factory for Enhanced Mould Release Efficiency
| Product Name | BPA | |
| Properties |
BPA dramatically affects the crystallization rate of POLYAMIDE compounds and leads to an efficient mould release.
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| Product Form | White Powder | |
| Specifications | TEST | SPECIFICATION |
| USAGE LEVEL | 0.15 – 0.20% in PA66 | |
| 0.30 – 0.50% in PA6 | ||
| ACTIVE CONC | 30–100% | |
| MELTING POINT | 160–180°C | |
| BASE | Polyamide | |
| Application |
Compounding with BPA ensures:
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Frequently Asked Questions
Q
What is BPA used for in polyamide compounding?
BPA is a nucleating and mould release agent specifically designed for polyamide (PA6 and PA66) compounds. It dramatically accelerates the crystallization rate and ensures efficient mould release during injection moulding and extrusion processes.
Q
What is the recommended usage level of BPA in PA66 and PA6?
For PA66, the recommended usage level is 0.15–0.20%. For PA6, the recommended usage level is 0.30–0.50%. These dosage ranges are optimized to deliver the best performance in terms of cycle time, mould release, and dimensional stability.
Q
What is the melting point of BPA?
BPA has a melting point range of 160–180°C, making it compatible with standard polyamide processing temperatures used in injection moulding and extrusion applications.
Q
What form does BPA come in, and what is its active concentration?
BPA is supplied as a white powder with an active concentration range of 30–100%. Its powder form enables easy and uniform dispersion during the compounding process.
Q
How does BPA improve the dimensional stability of moulded parts?
By accelerating and controlling the crystallization rate of polyamide, BPA promotes a more uniform and consistent crystalline structure within the part. This results in reduced warpage and improved dimensional stability for both injection moulded and extruded articles.
Q
Is BPA compatible with both PA6 and PA66 base resins?
Yes, BPA is based on a polyamide carrier and is fully compatible with both PA6 and PA66 resin systems. It can be incorporated during the compounding stage and works effectively across a range of polyamide formulations.